• DocumentCode
    228050
  • Title

    Enhanced performance of a thermal ground plane utilizing an Inorganic Aqueous Solution

  • Author

    Karimi, Alireza ; Reilly, S. ; Catton, I.

  • Author_Institution
    Mech. & Aerosp. Eng. Dept., Univ. of California, Los Angeles, Los Angeles, CA, USA
  • fYear
    2014
  • fDate
    27-30 May 2014
  • Firstpage
    1235
  • Lastpage
    1243
  • Abstract
    In this paper, two TGPs with monoporous sintered wick structures fabricated from spherical copper particles, are studied. The TGPs used in this study are 3" by 5" troughs, 4.8mm in depth, made of copper. On the back side of the trough, a 1cm2 raised section, referred to as pedestal, is used as a heater interface; pedestal is subjected to heat fluxes from 50 to 250 W/cm2 and the data is recorded when steady state is achieved at each heat flux. The objective of this study is to investigate the effect of working fluid on two TGPs with different monoporous wick structures. The result of the comparison between TGPs charged with water and with IAS has shown a remarkable improvement in performance of IAS charged TGPs, relative to water, when used in the same device. The use of IAS enables one to significantly improve thermal performance and broaden the operating temperature range in vapor chambers.
  • Keywords
    cooling; copper; heat sinks; sintering; thermal conductivity; TGP; heat flux; heat spreader; heater interface; inorganic aqueous solution; monoporous sintered wick structures; size 4.8 mm; spherical copper particles; thermal ground plane; thermal performance; vapor chambers; working fluid; Fluids; Heat transfer; Performance evaluation; Resistance; Resistance heating; Temperature measurement; Converging wick; Electronic cooling; Heat spreader; Heat transfer enhancement; IAS; Inorganic Aqueous Solution; Monoporous wick; TGP; Thermal Ground Plane; Vapor Chamber;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on
  • Conference_Location
    Orlando, FL
  • ISSN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2014.6892422
  • Filename
    6892422