Title :
A 65+ Gflop/s unstructured finite element simulation of chemically reacting flows on the Intel Paragon
Author :
Shadid, John N. ; Hutchinson, Scott A. ; Moffat, Harry K. ; Hennigan, Gary L. ; Hendrickson, Bruce ; Leland, Robert W.
Author_Institution :
Sandia Nat. Labs., Albuquerque, NM, USA
Abstract :
Many scientific and engineering applications require a detailed analysis of complex systems with strongly coupled fluid flow, thermal energy transfer mass transfer and nonequilibrium chemical reactions. Here we describe the performance of a newly developed application code, SALSA, designed to simulate these complex flows on large-scale parallel machines such as the Intel Paragon. SALSA uses 3D unstructured finite element methods to model geometrically complex flow systems. Fully implicit time integration, multicomponent mass transport and general gas phase and surface species non-equilibrium chemical kinetics are employed. Using these techniques we have obtained over 65 Gflop/s on a 3D chemically reacting flow CVD problem for Silicon Carbide (SiC) deposition. This represents 46% of the peak performance of our 1904 node Intel Paragon, an outstanding computational rate in view of the required unstructured data communication
Keywords :
chemistry computing; digital simulation; finite element analysis; flow simulation; parallel algorithms; parallel machines; performance evaluation; 3D unstructured finite element methods; 65 GFLOPS; Intel Paragon; SALSA; application code; chemically reacting flows; computational rate; engineering applications; geometrically complex flow systems; large-scale parallel machines; mass transfer; nonequilibrium chemical kinetics; nonequilibrium chemical reactions; peak performance; strongly coupled fluid flow; thermal energy transfer; time integration; unstructured data communication; unstructured finite element simulation; Chemical analysis; Chemical engineering; Chemical vapor deposition; Energy exchange; Finite element methods; Fluid flow; Large-scale systems; Power engineering and energy; Silicon carbide; Thermal engineering;
Conference_Titel :
Supercomputing '94., Proceedings
Conference_Location :
Washington, DC
Print_ISBN :
0-8186-6605-6
DOI :
10.1109/SUPERC.1994.344332