DocumentCode :
228062
Title :
Nanosecond time-resolved visualization of short pulse laser ablation processes for various laser beam profiles
Author :
Hong Duc Doan ; Iwatani, Naoki ; Sasaki, Hiromu ; Matsumura, Syo ; Fushinobu, Kazuyoshi
Author_Institution :
Tokyo Inst. of Technol., Tokyo, Japan
fYear :
2014
fDate :
27-30 May 2014
Firstpage :
1279
Lastpage :
1284
Abstract :
Thermal and fluid behavior are governing factors for the via processing of semiconducting substrates. In order to investigate the fundamentals, nanosecond (ns) time-resolved visualization of ns-pulse Nd:YAG laser ablation of SiC substrate has been performed for various conditions. Time-resolved visualizations have been conducted by using a ultra high speed camera with the frame rate of 200 million frames/second for the first time to reveal the ablation process in a single event with the temporal resolution of 5 ns. Both self-emitting light from the ablation plume and the shadow image due to the refractive index profile are visualized. The results show unique features for each spatial beam profiles (Gaussian, quasi-flat top, annular) with different beam energy. Combined with the previous experimental observations, the results help modeling the thermo-fluid numerical modeling of the ablation process.
Keywords :
cameras; laser ablation; laser beams; neodymium; solid lasers; time resolved spectra; SiC; SiC substrate; YAG:Nd; ablation plume; laser beam profiles; nanosecond time-resolved visualization; ns-pulse Nd:YAG laser ablation; refractive index profile; self-emitting light; shadow image; short pulse laser ablation processes; thermo-fluid numerical modeling; ultra high speed camera; Cameras; Laser ablation; Laser beams; Particle beams; Plasmas; Surface emitting lasers; Visualization; laser ablation; laser beam profile; short pulse laser; thermo-fluid modeling; time-resolved visualization; ultra high speed camera;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on
Conference_Location :
Orlando, FL
ISSN :
1087-9870
Type :
conf
DOI :
10.1109/ITHERM.2014.6892428
Filename :
6892428
Link To Document :
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