Title :
Failure analysis and test for high speed packaging, HDMI packaging and QSFP packaging
Author :
Xiang, Haifei ; Song, Jian ; Liu, Fengman ; Gao, Wei ; Li, Baoxia ; Wan, Lixi
Author_Institution :
Inst. of Microelectron., Chinese Acad. of Sci., Beijing, China
Abstract :
In this paper we present several failures in optical packaging. Then we analysis the main reasons of these failures. Next, we suggest ways to avoid similar failures. Several simple examinations are also introduced. Innovative diagnostics methods are described and time saving test methods are described.
Keywords :
electronics packaging; failure analysis; HDMI packaging; QSFP packaging; failure analysis; high speed packaging; optical packaging; Bonding; Electrostatic discharge; Force; Gold; Optical fibers; Packaging; Partial discharges;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4244-8140-8
DOI :
10.1109/ICEPT.2010.5582750
