Title :
Comparison investigation of thermal fatigue and mechanical fatigue behavior of board level solder joint
Author :
Lin, Jian ; Lei, Yongping ; Wu, Zhongwei ; Yin, Lanli
Author_Institution :
Coll. of Mater. Sci. & Eng., Beijing Univ. of Technol., Beijing, China
Abstract :
The thermal fatigue and mechanical fatigue are the two main failure modes for board level solder joint in SMT. The comparison investigation of thermal fatigue and mechanical fatigue behavior of solder joint are carried out by experimental method in this study. The surface mounted test PCB is used and two kinds of solder materials, including SAC305 and Sn37Pb, are considered. It is shown that lead-free solder joint (SAC305) has a longer thermal fatigue lifetime, but a shorter mechanical fatigue lifetime than traditional eutectic lead-tin solder. Moreover, the inelastic strain (including creep and plastic strain) evolutions of solder joint during thermal and mechanical fatigue procedure are analyzed by FEM individually. It shows that the creep and plastic strain in mechanical fatigue procedure is different from those in thermal fatigue.
Keywords :
creep; eutectic alloys; failure analysis; fatigue; finite element analysis; plastic deformation; printed circuits; solders; surface mount technology; thermal stress cracking; FEM; SMT; board level solder joint; comparison investigation; creep; eutectic lead-tin solder; failure modes; inelastic strain; lead-free solder joint; mechanical fatigue lifetime; plastic strain; solder materials; surface mounted test PCB; thermal fatigue lifetime; Creep; Fatigue; Lead; Plastics; Soldering; Strain; FEM; Mechanical fatigue; Solder joint; Surface mounted Technology; Thermal fatigue;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4244-8140-8
DOI :
10.1109/ICEPT.2010.5582756
