Title :
A vertically integrated media-isolated absolute pressure sensor
Author :
Goldman, Ken ; Gritt, George ; Baskett, Ira ; Sooriakumar, K. ; Wallace, Dan ; Hughes, Don ; Shah, Mahesh
Author_Institution :
Semicond. Products Sector, Motorola Inc., Phoenix, AZ, USA
Abstract :
A novel, media-isolated, temperature-compensated, bulk-micromachined integrated absolute pressure sensor has successfully been developed. The sensor is usable for most applications involving exposure to harsh media, such as fuel vapor seen by manifold absolute pressure (MAP) sensors. Characterization of the device indicates that the devices fabricated meet specifications of a MAP sensor
Keywords :
compensation; micromachining; microsensors; piezoresistive devices; pressure sensors; absolute pressure sensor; bulk-micromachined sensor; device characterization; fuel vapor; harsh media exposure; manifold absolute pressure sensor specification; media-isolated pressure sensor; temperature compensation; vertically integrated pressure sensor; Costs; Etching; Glass; Packaging; Piezoresistance; Sensor phenomena and characterization; Temperature sensors; Transducers; Wafer bonding; Wafer scale integration;
Conference_Titel :
Solid State Sensors and Actuators, 1997. TRANSDUCERS '97 Chicago., 1997 International Conference on
Conference_Location :
Chicago, IL
Print_ISBN :
0-7803-3829-4
DOI :
10.1109/SENSOR.1997.635750
