Title :
Investigation of thermomigration in composite SnPb solder joints
Author :
Tao, Y. ; Ding, L. ; Wu, Y.P. ; Shangguan, Dongkai ; Wu, B.Y.
Author_Institution :
Huazhong Univ. of Sci. & Technol., Wuhan, China
Abstract :
Due to the increasing functional demand and miniaturization in high-density microelectronics packaging, thermomigration in flip chip solder joints owing to Joule heating becomes a serious reliability issue. In recent years, a series of researches have been devoted to examining the failure mechanism of thermomigration in eutectic SnPb and lead-free solder joints. However, only a few studies were focused on the thermomigration phenomenon at room temperature. Also, the investigation of thermomigration in solder joints of commercial products was insufficient.
Keywords :
ball grid arrays; flip-chip devices; lead alloys; reliability; solders; tin alloys; Joule heating; SnPb; failure mechanism; flip chip solder joints; functional demand; high-density microelectronics packaging; temperature 293 K to 298 K; thermomigration; Copper; Flip chip; Graphics processing unit; Microstructure; Soldering; Substrates; Tin; Composite solder joint; Temperature gradient; Thermomigration;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4244-8140-8
DOI :
10.1109/ICEPT.2010.5582761
