Title :
Welding failure analysis of tungsten-copper composite material used for microwave circuits
Author :
Jianhai, Ye ; Shengxiang, Bao ; Lili, Ma ; Guanghua, Shi ; Peng, Li
Author_Institution :
State Key Lab. of Electron. Thin Films & Integrated Devices, Univ. of Electron. Sci. & Technol. of China, Chengdu, China
Abstract :
Due to have excellent thermal, electrical performance, W-Cu composite materials were wildly used in high-power microwave devices and large-scale integrated circuits as the substrate, embedded blocks, connectors and heat dissipation devices. This paper aiming at the problem of welding failure between a batch of home-made W-Cu composite materials and the Kovar alloy when doing microwave circuit welding. Compared with to the import W-Cu composite materials, scanning electron microscopy (SEM) and electron probe energy dispersive spectroscopy (EDS) were carried out on the microstructure and micro-area composition analysis. The poor welding causes of the materials were found. Through improved technology, increase the Cu content in the Cu-W composite material, and its weld ability with Kovar alloy was enhanced.
Keywords :
composite materials; copper; failure analysis; integrated circuits; microwave circuits; scanning electron microscopy; tungsten; welding; EDS; Kovar alloy; SEM; W-Cu; connectors; electron probe energy dispersive spectroscopy; heat dissipation devices; high-power microwave devices; large-scale integrated circuits; microwave circuit welding; microwave circuits; scanning electron microscopy; tungsten-copper composite material; welding failure analysis; Composite materials; Copper; Scanning electron microscopy; Surface morphology; Tungsten; Welding;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4244-8140-8
DOI :
10.1109/ICEPT.2010.5582762