• DocumentCode
    2281285
  • Title

    A verification of application specific component qualification

  • Author

    Challa, Vidyu ; Pecht, Michael ; Liu, Shilin ; Yu, Qiang

  • Author_Institution
    Center for Adv. Life Cycle Eng. (CALCE), Univ. of Maryland, College Park, MD, USA
  • fYear
    2010
  • fDate
    16-19 Aug. 2010
  • Firstpage
    1265
  • Lastpage
    1268
  • Abstract
    Semiconductor component manufacturers supply to different product manufacturers in a wide range of market segments, for different end use applications. The goal of electronic component qualification is to demonstrate component reliability under operating conditions in the end product configuration. While a manufacturer may have successfully qualified an individual component, operating stresses due to surrounding components or the system can decrease individual component reliability. Not accounting for these operating stresses resulting from other components or the system will lead to lower life than anticipated. Using a case study, the authors demonstrate how the fatigue life of a chip component mounted on a PCB is affected by powered components on the board in close proximity.
  • Keywords
    fatigue; internal stresses; printed circuits; semiconductor device manufacture; semiconductor device reliability; PCB; application specific component qualification; chip component; electronic component qualification; end product configuration; fatigue life; individual component reliability; market segments; operating stresses; product manufacturers; semiconductor component manufacturers; Fatigue; Light emitting diodes; Qualifications; Reliability engineering; Soldering; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
  • Conference_Location
    Xi´an
  • Print_ISBN
    978-1-4244-8140-8
  • Type

    conf

  • DOI
    10.1109/ICEPT.2010.5582783
  • Filename
    5582783