DocumentCode
2281285
Title
A verification of application specific component qualification
Author
Challa, Vidyu ; Pecht, Michael ; Liu, Shilin ; Yu, Qiang
Author_Institution
Center for Adv. Life Cycle Eng. (CALCE), Univ. of Maryland, College Park, MD, USA
fYear
2010
fDate
16-19 Aug. 2010
Firstpage
1265
Lastpage
1268
Abstract
Semiconductor component manufacturers supply to different product manufacturers in a wide range of market segments, for different end use applications. The goal of electronic component qualification is to demonstrate component reliability under operating conditions in the end product configuration. While a manufacturer may have successfully qualified an individual component, operating stresses due to surrounding components or the system can decrease individual component reliability. Not accounting for these operating stresses resulting from other components or the system will lead to lower life than anticipated. Using a case study, the authors demonstrate how the fatigue life of a chip component mounted on a PCB is affected by powered components on the board in close proximity.
Keywords
fatigue; internal stresses; printed circuits; semiconductor device manufacture; semiconductor device reliability; PCB; application specific component qualification; chip component; electronic component qualification; end product configuration; fatigue life; individual component reliability; market segments; operating stresses; product manufacturers; semiconductor component manufacturers; Fatigue; Light emitting diodes; Qualifications; Reliability engineering; Soldering; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
Conference_Location
Xi´an
Print_ISBN
978-1-4244-8140-8
Type
conf
DOI
10.1109/ICEPT.2010.5582783
Filename
5582783
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