DocumentCode :
2281474
Title :
Physical modeling of transient enhanced diffusion and dopant deactivation via extended defect evolution
Author :
Gencer, A.H. ; Chakravarthi, S. ; Dunham, S.T.
Author_Institution :
Dept. of Electr. & Comput. Eng., Boston Univ., MA, USA
fYear :
1997
fDate :
8-10 Sept. 1997
Firstpage :
77
Lastpage :
80
Abstract :
Simulation of ion implant annealing requires adequate models for a range of processes, including deactivation of dopants and transient enhanced diffusion. It is now well understood that extended defects ({311} defects, dislocation loops, BICs, arsenic precipitates, etc.) play a central role in all these processes. We have developed a fundamental model which can account for the behavior of a broad range of extended defects, as well as their interactions with each other. We have successfully applied and parameterized our model to a range of systems and conditions, some of which are presented in this paper. We also present how these processes couple with each other, as well as standard coupled dopant diffusion, by terms of a simple MOSFET structure.
Keywords :
MOSFET; annealing; diffusion; dislocation loops; interstitials; ion implantation; precipitation; semiconductor process modelling; MOSFET; Si:As; Si:P; arsenic precipitate; boron interstitial cluster; dislocation loop; dopant deactivation; extended defect evolution; ion implant annealing; physical model; simulation; transient enhanced diffusion; {311} defect; Cascading style sheets; Cognitive science; Computational modeling; Computer simulation; Implants; Kinetic theory; MOSFET circuits; Semiconductor process modeling; Simulated annealing; Solid modeling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Simulation of Semiconductor Processes and Devices, 1997. SISPAD '97., 1997 International Conference on
Conference_Location :
Cambridge, MA, USA
Print_ISBN :
0-7803-3775-1
Type :
conf
DOI :
10.1109/SISPAD.1997.621340
Filename :
621340
Link To Document :
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