Title :
Piezoresistive pressure sensors based on system in packaging technology of MEMS
Author :
Shi, Xiong ; Xu, Jian ; Gan, Zhiyin ; Liu, Sheng
Author_Institution :
Electr. & Inf. Dept., Wuhan Polytech. Univ., Wuhan, China
Abstract :
The die of piezoresistance based pressure sensor and its driving circuits has been integrated into one printed circuit board which is specially designed. Then the whole PCB is packaged into a metal shell by SIP technology and special packaging techniques to form a full pressure sensor. Tests have proved that this kind of pressure sensor has good performance. Compared with traditional pressure sensors, these sensors based on SIP have small volume, low cost, and could compatible with the strict standard of vehicle.
Keywords :
detector circuits; driver circuits; microsensors; piezoresistive devices; pressure sensors; printed circuits; system-in-package; MEMS; driving circuits; piezoresistive pressure sensors; printed circuit board; system-in-package technology; Packaging; Petroleum; Piezoresistance; Printed circuits; Silicon; Temperature sensors;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4244-8140-8
DOI :
10.1109/ICEPT.2010.5582806
