DocumentCode
2281675
Title
Piezoresistive pressure sensors based on system in packaging technology of MEMS
Author
Shi, Xiong ; Xu, Jian ; Gan, Zhiyin ; Liu, Sheng
Author_Institution
Electr. & Inf. Dept., Wuhan Polytech. Univ., Wuhan, China
fYear
2010
fDate
16-19 Aug. 2010
Firstpage
1337
Lastpage
1341
Abstract
The die of piezoresistance based pressure sensor and its driving circuits has been integrated into one printed circuit board which is specially designed. Then the whole PCB is packaged into a metal shell by SIP technology and special packaging techniques to form a full pressure sensor. Tests have proved that this kind of pressure sensor has good performance. Compared with traditional pressure sensors, these sensors based on SIP have small volume, low cost, and could compatible with the strict standard of vehicle.
Keywords
detector circuits; driver circuits; microsensors; piezoresistive devices; pressure sensors; printed circuits; system-in-package; MEMS; driving circuits; piezoresistive pressure sensors; printed circuit board; system-in-package technology; Packaging; Petroleum; Piezoresistance; Printed circuits; Silicon; Temperature sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
Conference_Location
Xi´an
Print_ISBN
978-1-4244-8140-8
Type
conf
DOI
10.1109/ICEPT.2010.5582806
Filename
5582806
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