Title :
Analytical model for sensor placement on microprocessors
Author :
Lee, Kyeong-Jae ; Skadron, Kevin ; Huang, Wei
Author_Institution :
Dept. of Comput. Sci., Electr. & Comput. Eng., Virginia Univ., Charlottesville, VA, USA
Abstract :
Thermal management in microprocessors has become a major design challenge in recent years. Thermal monitoring through hardware sensors is important, and these sensors must be carefully placed on the chip to account for thermal gradients. In this paper, we present an analytical model that describes the maximum temperature differential between a hot spot and a region of interest based on their distance and processor packaging information. We also use a run-time thermal model, as an illustration of virtual sensors, and examine two benchmarks that exhibit highly concentrated thermal stress. We then use our analytical model to demonstrate the safety margins of the chip. Ultimately, the mathematical expression allows designers to obtain worst-case behavior of thermal heatup and select the optimal location of additional sensors.
Keywords :
integrated circuit modelling; logic design; microprocessor chips; sensors; thermal management (packaging); hardware sensor; maximum temperature differential; microprocessor; processor packaging information; run-time thermal model; sensor placement; thermal gradient; thermal heatup; thermal management; thermal monitoring; thermal stress; virtual sensor illustration; Analytical models; Hardware; Microprocessors; Monitoring; Packaging; Runtime; Temperature sensors; Thermal management; Thermal sensors; Thermal stresses;
Conference_Titel :
Computer Design: VLSI in Computers and Processors, 2005. ICCD 2005. Proceedings. 2005 IEEE International Conference on
Print_ISBN :
0-7695-2451-6
DOI :
10.1109/ICCD.2005.23