Atomic vapor cell fabrication for atomic clock based on vacuum packaging by multi-stack anodic bonding using two electrodes

Miniaturized atomic clock that could provide the most stable frequency reference is demanded strongly in a large number of applications such as communication, satellite navigation and science measurement etc. The miniaturization is mainly developed by CPT phenomenon which depends on the miniaturized atomic vapor cell without microwave cavity. With the rarely reported triple-stack anodic bonding in MEMS packaging, we developed a method based on vacuum packaging to conduct the glass-silicon-glass anodic bonding using two electrodes for atomic vapor cell fabrication. Furthermore we developed a setup specially for the vapor cell. Some samples with the alkali metal rubidium were made through this setup. Tensile testing showed the bonding strength is above 10 MPa, and spectrum analysis demonstrated the alkali metal was well sealed.