DocumentCode :
2281860
Title :
Study on adhesive reliability of low-temperature sintered high power LED modules
Author :
Li, Xin ; Chen, Xu ; Yu, Dun-Ji ; Lu, Guo-Quan
Author_Institution :
Sch. of Mater. Sci. & Eng., Tianjin Univ., Tianjin, China
fYear :
2010
fDate :
16-19 Aug. 2010
Firstpage :
1371
Lastpage :
1376
Abstract :
Low temperature sintered nano-silver paste becomes a potential alternative in green electrical packaging because of its higher thermal and electrical conductivity than conventional solders. It can be used for connected chips that require high temperature operation, such as high power LED and power electronics modules, etc. During service, alternating shear strain, even thermal fatigue failure will occur due to thermal expansion coefficient mismatch of chip and substrate. Therefore, it is necessary to study the reliability and failure mechanism of low temperature sintered nano-silver joint. In this study, loading-control shear fatigue tests, temperature cycling and hygrothermal aging tests were conducted on sintered nano-silver paste connected LED modules, through which we made an initial exploration on the mechanical reliability and failure mechanism of this new type of interconnection material.
Keywords :
adhesives; ageing; electrical conductivity; fatigue testing; light emitting diodes; reliability; silver; sintering; thermal expansion; thermal stress cracking; adhesive reliability; alternating shear strain; electrical conductivity; green electrical packaging; hygrothermal aging tests; low-temperature sintered high power LED modules; mechanical reliability; nano-silver paste; shear fatigue tests; temperature cycling; thermal expansion coefficient; thermal fatigue failure; Aging; Cavity resonators; Electronic packaging thermal management; Fatigue; Joints; Light emitting diodes; Packaging;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4244-8140-8
Type :
conf
DOI :
10.1109/ICEPT.2010.5582818
Filename :
5582818
Link To Document :
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