Title :
Capacitive detection method evaluation for silicon accelerometer by physical parameter extraction from finite element simulations
Author :
Ansel, Y. ; Romanowicz, B. ; Laudon, M. ; Renaud, P. ; Schropfer, G.
Author_Institution :
Inst. of Microsyst., Swiss Fed. Inst. of Technol., Lausanne, Switzerland
Abstract :
A capacitance evaluation method based on the extraction of physical parameters from finite element (FE) analysis is presented. Mechanical simulations and this capacitance evaluation method were applied to a new, highly symmetrical, silicon accelerometer in view of globally modeling the sensor system. The commercial hardware description language HDLA/sup TM/ is used to develop a compact behavioral macromodels for SPICE simulators.
Keywords :
SPICE; accelerometers; capacitance measurement; elemental semiconductors; finite element analysis; hardware description languages; microsensors; silicon; HDLA; SPICE; Si; behavioral macromodel; capacitive detection; finite element simulation; global model; hardware description language; mechanical simulation; microsensor; physical parameter extraction; silicon accelerometer; Accelerometers; Analytical models; Capacitance; Finite element methods; Hardware design languages; Parameter extraction; SPICE; Semiconductor process modeling; Silicon; Solid modeling;
Conference_Titel :
Simulation of Semiconductor Processes and Devices, 1997. SISPAD '97., 1997 International Conference on
Conference_Location :
Cambridge, MA, USA
Print_ISBN :
0-7803-3775-1
DOI :
10.1109/SISPAD.1997.621353
