Investigation on fabricating high SiC volume fraction of electronic package shell by means of semi-solid forming

Based on the research of modern electronic packaging materials, Semi-solid forming technology was used to fabricate electronic packaging shell in this study. Packaging material of SiC reinforced A356 aluminum alloy was prepared by mechanical mixing method and the SiCp/Al composite billet was formed by means of thixo-forging to manufacture the electronic packaging shell. The numerical simulation was conducted for investigating the process of thixo-extrusion with SiCp/A356 composites. Then microstructure of the produced parts and simulation results were investigated. The results showed that after being heated to 600°C and held for 3 hours, SiCp had good compatibility with A356 aluminum alloy and the SiCp/A356 composite billet could meet the requirements of thixo-forging. The investigation showed that thixoforming technology could be used in producing electronic package shell with high SiC volume fraction from SiCp/A356 composites.