DocumentCode
2282449
Title
Architecture of 3D Memory Cell Array on 3D IC
Author
Lee, Sang-Yun ; Park, Junil
Author_Institution
BeSang Inc., Beaverton, OR, USA
fYear
2012
fDate
20-23 May 2012
Firstpage
1
Lastpage
3
Abstract
High density 3D memory cell array using SGT(Surrounding Gate Transistor) on 3D IC is proposed. SGT with 4F2 cell size shows uniform cell characteristics with a low resistive bit-line path on 3D IC. Parasitic bit-line capacitance of the structure can also be much lower compared to conventional 2D memory cell array or SGT cell array on bulk substrate, which is especially good for memory feature size at or below 10 nm cell node. A combination of 3D memory cell and 3D IC seems to be the ideal memory architecture for the low cost-per- bit of high density memories.
Keywords
DRAM chips; integrated circuits; transistors; 3D IC; 3D memory cell array architecture; SGT; conventional 2D memory cell array; high density memory; low cost-per-bit; low resistive bit-line path; parasitic bit-line capacitance; surrounding gate transistor; Arrays; Junctions; Logic gates; Microprocessors; Three dimensional displays;
fLanguage
English
Publisher
ieee
Conference_Titel
Memory Workshop (IMW), 2012 4th IEEE International
Conference_Location
Milan
Print_ISBN
978-1-4673-1079-6
Type
conf
DOI
10.1109/IMW.2012.6213640
Filename
6213640
Link To Document