Title :
Microstructure and solderability of Sn-3.5Ag-0.5Cu-xBi-ySb solders
Author :
Lu, Sheng ; Zheng, Zhixia ; Chen, Jing ; Luo, Fei
Author_Institution :
Dept. of Welding & Mater. Forming, Jiangsu Univ. of Sci. & Technol., Zhenjiang, China
Abstract :
Lead-free solders were prepared by adding a small quantity of Bi, Sb element into Sn-3.5Ag-0.5Cu alloy. By means of OM, SEM, EDS, DTA and solderability test, effects of Bi and Sb elements on microstructure, solderability and melting characteristic were investigated. The results show that with the increase of Bi and Sb addition into Sn-3.5Ag-0.5Cu solder, the primary β-Sn phrase decreased gradually and tiny inter-metallic compounds increased. Bi presents obvious effects on depressing the melting temperature but broadening the melting range. And the addition of Sb has little effect on melting temperature but broadens the melting range too. Adding suitable amount of Bi and Sb into the solder alloy may help improve the solderability.
Keywords :
X-ray chemical analysis; alloying additions; antimony alloys; bismuth alloys; copper alloys; crystal microstructure; differential thermal analysis; melting point; optical microscopy; scanning electron microscopy; silver alloys; soldering; solders; tin alloys; Bi element addition effects; DTA; EDS; OM; SEM; Sb element addition effects; SnAgCuBiSb; differential thermal analysis; energy-dispersive spectroscopy; intermetallic compounds; lead-free solders; melting range; melting temperature; microstructure; optical microscopy; primary β-Sn phase; scanning electron microscopy; solderability test; Bismuth; Compounds; Lead; Microstructure; Soldering; Tin; Sn-Ag-Cu-Bi-Sb lead-free solder; melting temperature; microstructure; solderability;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4244-8140-8
DOI :
10.1109/ICEPT.2010.5582854
