Title :
A system-level equivalent circuit method for the electrical performance modeling of electronic packages
Author :
Wei, Xing-Chang ; Li, Er-Ping
Abstract :
In this paper, we propose a system-level field-circuit method for the signal integrity and power integrity simulation of power distribution networks inside the electronic packages. The electromagnetic field inside the power distribution network is expressed in the modal field distribution. The modal field is then decomposed into the parallel plate mode and transmission mode, which are related to the power-ground planes and signal traces respectively. Integral equations are created for these two modes. Through the discretization of the integral equations, network ports are defined between the power/ground planes and signal traces. In this way, their equivalent networks are extracted through the moments method solution of the integral equations. Finally, these two equivalent networks are combined together with the equivalent circuit of the through-hole via to provide the whole circuit model of the power distribution network. Through numerical examples, the accuracy and efficiency of the proposed method are verified.
Keywords :
electronics packaging; equivalent circuits; integral equations; method of moments; electrical performance modeling; electromagnetic field; electronic package; integral equation; modal field distribution; moments method solution; parallel plate mode; power distribution network; power integrity simulation; signal integrity; system-level equivalent circuit method; through-hole-via; transmission mode; Computational modeling; Electronics packaging; Equivalent circuits; Integral equations; Integrated circuit modeling; Mathematical model; Power systems;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4244-8140-8
DOI :
10.1109/ICEPT.2010.5582866