Title :
Reliability metrics for IGBT power modules
Author :
Newcombe, D.R. ; Chamund, Dinesh ; Bailey, C. ; Lu, H.
Author_Institution :
Dynex Semicond. Ltd., Lincoln, UK
Abstract :
In the field of IGBT modules, there is currently a plethora of new packaging materials being developed with a view to increased “reliability”. Whilst this approach is often essential to meet the needs for the ever increased demand in harsher environments, the result can often be seen as an over-engineered solution with resultant excessive cost. This paper will present a case study addressing how process control techniques of the substrate solder can demonstrate a significant improvement in the reliability of the product.
Keywords :
insulated gate bipolar transistors; multichip modules; power bipolar transistors; semiconductor device reliability; solders; IGBT power modules; over-engineered solution; packaging materials; process control techniques; product reliability; reliability metrics; resultant excessive cost; substrate solder; Copper; Insulated gate bipolar transistors; Multichip modules; Reliability; Soldering; Substrates;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4244-8140-8
DOI :
10.1109/ICEPT.2010.5582869
