• DocumentCode
    2282706
  • Title

    Physical Modeling and Analysis on Improved Endurance Behavior of P-Type Floating Gate NAND Flash Memory

  • Author

    Lee, ChangHyun ; Fayrushin, Albert ; Hur, Sunghoi ; Park, Youngwoo ; Choi, Jungdal ; Choi, Jeonghyuk ; Chung, Chilhee

  • Author_Institution
    Semicond. R&D Center, Samsung Electron. Co. Ltd., Hwasung, South Korea
  • fYear
    2012
  • fDate
    20-23 May 2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    In this work, we report improved endurance of p-type floating-gate NAND flash cell. The physical model on the endurance and data retention of p-type floating-gate NAND cells is proposed and the model is verified by using device simulation to elucidate the cause that p-type floating gate has better endurance than n-type floating-gate. The hole currents injected from Si substrate begin to participate in erase operation by using p-type floating gate and the contribution of the holes results in more probable hole-trapping and neutralizing the electron trap in a tunnel oxide with cycling stress. Such hole compensation effect is thought to induce better endurance in p-type floating-gate cell than n-type floating gate cell.
  • Keywords
    NAND circuits; electron traps; elemental semiconductors; flash memories; hole traps; silicon; NAND flash memory; P-type floating gate; Si; Si substrate; cycling stress; electron trap; endurance behavior; hole compensation effect; hole current; hole-trapping; n-type floating-gate; tunnel oxide; Electron traps; Flash memory; Logic gates; Nonvolatile memory; Stress; Tunneling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Memory Workshop (IMW), 2012 4th IEEE International
  • Conference_Location
    Milan
  • Print_ISBN
    978-1-4673-1079-6
  • Type

    conf

  • DOI
    10.1109/IMW.2012.6213655
  • Filename
    6213655