• DocumentCode
    2282720
  • Title

    Effect of fixing material on skin-contact temperature measurement by wearable sensor

  • Author

    Deng, Zhong-Shan ; Liu, Jing

  • Author_Institution
    Tech. Inst. of Phys. & Chem., Chinese Acad. of Sci., Beijing
  • fYear
    2008
  • fDate
    1-3 June 2008
  • Firstpage
    137
  • Lastpage
    140
  • Abstract
    Recent advances in wearable sensors, as well as wireless technology and mobile computing have fostered a dramatic growth of a new generation of monitoring systems that allow one to record physiological data from individuals carrying on daily activities in the home and outdoor environments. For many applications of wearable systems, there is typically a need for achieving stable contact of the sensing elements with the skin, which requires that sensors be embedded in a fixing material (which can be an elastic bandage or a tightly-fit undergarment). However, when performing temperature monitoring in this way, measurement error may be resulted from the change of heat transfer of the local skin area by the fixing material. This study aims to disclose the effect of the fixing material on temperature measurement via skin-contact wearable sensors. The results of this study are expected to be valuable for designing wearable devices of temperature measurement.
  • Keywords
    biomedical equipment; biomedical measurement; biothermics; patient monitoring; wireless sensor networks; elastic bandage; fixing material effects; mobile computing; monitoring systems; skin contact temperature measurement; temperature monitoring; tightly fit undergarment; wearable sensor; wireless technology; Biomedical monitoring; Home computing; Mobile computing; Sensor systems and applications; Skin; Temperature measurement; Temperature sensors; Wearable computers; Wearable sensors; Wireless sensor networks;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Medical Devices and Biosensors, 2008. ISSS-MDBS 2008. 5th International Summer School and Symposium on
  • Conference_Location
    Hong Kong
  • Print_ISBN
    978-1-4244-2252-4
  • Electronic_ISBN
    978-1-4244-2253-1
  • Type

    conf

  • DOI
    10.1109/ISSMDBS.2008.4575037
  • Filename
    4575037