DocumentCode :
2282720
Title :
Effect of fixing material on skin-contact temperature measurement by wearable sensor
Author :
Deng, Zhong-Shan ; Liu, Jing
Author_Institution :
Tech. Inst. of Phys. & Chem., Chinese Acad. of Sci., Beijing
fYear :
2008
fDate :
1-3 June 2008
Firstpage :
137
Lastpage :
140
Abstract :
Recent advances in wearable sensors, as well as wireless technology and mobile computing have fostered a dramatic growth of a new generation of monitoring systems that allow one to record physiological data from individuals carrying on daily activities in the home and outdoor environments. For many applications of wearable systems, there is typically a need for achieving stable contact of the sensing elements with the skin, which requires that sensors be embedded in a fixing material (which can be an elastic bandage or a tightly-fit undergarment). However, when performing temperature monitoring in this way, measurement error may be resulted from the change of heat transfer of the local skin area by the fixing material. This study aims to disclose the effect of the fixing material on temperature measurement via skin-contact wearable sensors. The results of this study are expected to be valuable for designing wearable devices of temperature measurement.
Keywords :
biomedical equipment; biomedical measurement; biothermics; patient monitoring; wireless sensor networks; elastic bandage; fixing material effects; mobile computing; monitoring systems; skin contact temperature measurement; temperature monitoring; tightly fit undergarment; wearable sensor; wireless technology; Biomedical monitoring; Home computing; Mobile computing; Sensor systems and applications; Skin; Temperature measurement; Temperature sensors; Wearable computers; Wearable sensors; Wireless sensor networks;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Medical Devices and Biosensors, 2008. ISSS-MDBS 2008. 5th International Summer School and Symposium on
Conference_Location :
Hong Kong
Print_ISBN :
978-1-4244-2252-4
Electronic_ISBN :
978-1-4244-2253-1
Type :
conf
DOI :
10.1109/ISSMDBS.2008.4575037
Filename :
4575037
Link To Document :
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