• DocumentCode
    2282835
  • Title

    Fast IO buffer modeling using neural network methods

  • Author

    Zhang, Q.J. ; Cao, Y. ; Erdin, I.

  • Author_Institution
    Carleton Univ., Ottawa, ON, Canada
  • fYear
    2010
  • fDate
    16-19 Aug. 2010
  • Firstpage
    666
  • Lastpage
    669
  • Abstract
    This paper provides an overview of a fast modeling approach for modeling the nonlinear IO buffers for signal integrity based simulation and design of high-speed electronic interconnect and packages. Techniques based on artificial neural network (ANN) modeling are developed, where the neural network is trained to learn from IO buffer data, and trained neural network becomes fast models representing the buffer during signal integrity simulation and design. The ANN approach is more accurate than typical empirical models, and is faster than detailed models such as detailed transistor-level or physics-based models.
  • Keywords
    integrated circuit interconnections; integrated circuit packaging; neural nets; artificial neural network; electronic packages; high-speed electronic interconnect; nonlinear IO buffer modeling; physics-based model; signal integrity simulation; transistor-level model; Artificial neural networks; Computational modeling; Data models; Driver circuits; Integrated circuit modeling; Recurrent neural networks; Training;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
  • Conference_Location
    Xi´an
  • Print_ISBN
    978-1-4244-8140-8
  • Type

    conf

  • DOI
    10.1109/ICEPT.2010.5582875
  • Filename
    5582875