DocumentCode
2282835
Title
Fast IO buffer modeling using neural network methods
Author
Zhang, Q.J. ; Cao, Y. ; Erdin, I.
Author_Institution
Carleton Univ., Ottawa, ON, Canada
fYear
2010
fDate
16-19 Aug. 2010
Firstpage
666
Lastpage
669
Abstract
This paper provides an overview of a fast modeling approach for modeling the nonlinear IO buffers for signal integrity based simulation and design of high-speed electronic interconnect and packages. Techniques based on artificial neural network (ANN) modeling are developed, where the neural network is trained to learn from IO buffer data, and trained neural network becomes fast models representing the buffer during signal integrity simulation and design. The ANN approach is more accurate than typical empirical models, and is faster than detailed models such as detailed transistor-level or physics-based models.
Keywords
integrated circuit interconnections; integrated circuit packaging; neural nets; artificial neural network; electronic packages; high-speed electronic interconnect; nonlinear IO buffer modeling; physics-based model; signal integrity simulation; transistor-level model; Artificial neural networks; Computational modeling; Data models; Driver circuits; Integrated circuit modeling; Recurrent neural networks; Training;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
Conference_Location
Xi´an
Print_ISBN
978-1-4244-8140-8
Type
conf
DOI
10.1109/ICEPT.2010.5582875
Filename
5582875
Link To Document