Title :
ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)
Abstract :
The following topics were dealt with: interfaces and contacting surfaces; flow network modelling; MEMS; heat sinks; thermal modelling; space systems; conduction fundamentals; mechanics simulation; heat pipes; convection; solder joint reliability; power electronics; and phase change materials
Keywords :
convection; heat conduction; heat pipes; heat sinks; micromechanical devices; power electronics; reliability; soldering; space vehicle electronics; thermal analysis; MEMS; conduction; contacting surfaces; convection; flow network modelling; heat pipes; heat sinks; interfaces; mechanics simulation; phase change materials; power electronics; solder joint reliability; space systems; thermal modelling;
Conference_Titel :
Acoustics, Speech, and Signal Processing, 2000. ICASSP '00. Proceedings. 2000 IEEE International Conference on
Conference_Location :
Istanbul, Turkey
Print_ISBN :
0-7803-6293-4
DOI :
10.1109/ICASSP.2000.859172
