Title :
CNT-BCB composites as a bonding interface material for 3D integration
Author :
Xu, Xiangming ; Tan, Zhimin ; Wang, Zheyao
Author_Institution :
Inst. of Microelectron., Tsinghua Univ., Beijing, China
Abstract :
Thermal management is one of the critical challenges in three-dimensional (3D) integration. This paper reports an approach to increasing the thermal conductivity of the bonding adhesive Benzocyclobutene (BCB) by loading carbon nanotubes (CNTs). By exploiting the aromatic property of BCB, an ultrasonication and mechanical stirring assisted non-covalent dispersion method is developed to disseminate CNTs with different concentrations ranging from 0.25% to 2% into BCB. The experimental results show a 70% improvement in the thermal conductivity by loading CNTs. The bonding strength of BCB-CNT composites were increased by CNTs.
Keywords :
adhesive bonding; carbon nanotubes; thermal conductivity; thermal management (packaging); three-dimensional integrated circuits; 3D integration; CNT-BCB composites; aromatic property; benzocyclobutene; bonding adhesive; bonding interface material; carbon nanotubes; mechanical stirring assisted noncovalent dispersion method; thermal conductivity; thermal management; three-dimensional integration; ultrasonication; Bonding; Carbon nanotubes; Conductivity; Dispersion; Plastics; Thermal conductivity; Three dimensional displays;
Conference_Titel :
Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2011 IEEE
Conference_Location :
Hanzhou
Print_ISBN :
978-1-4673-2288-1
Electronic_ISBN :
2151-1225
DOI :
10.1109/EDAPS.2011.6213725
