CNT-BCB composites as a bonding interface material for 3D integration

Author

Xu, Xiangming ; Tan, Zhimin ; Wang, Zheyao

Author_Institution

Inst. of Microelectron., Tsinghua Univ., Beijing, China

fYear

2011

fDate

12-14 Dec. 2011

Firstpage

1

Lastpage

4

Abstract

Thermal management is one of the critical challenges in three-dimensional (3D) integration. This paper reports an approach to increasing the thermal conductivity of the bonding adhesive Benzocyclobutene (BCB) by loading carbon nanotubes (CNTs). By exploiting the aromatic property of BCB, an ultrasonication and mechanical stirring assisted non-covalent dispersion method is developed to disseminate CNTs with different concentrations ranging from 0.25% to 2% into BCB. The experimental results show a 70% improvement in the thermal conductivity by loading CNTs. The bonding strength of BCB-CNT composites were increased by CNTs.

Keywords

adhesive bonding; carbon nanotubes; thermal conductivity; thermal management (packaging); three-dimensional integrated circuits; 3D integration; CNT-BCB composites; aromatic property; benzocyclobutene; bonding adhesive; bonding interface material; carbon nanotubes; mechanical stirring assisted noncovalent dispersion method; thermal conductivity; thermal management; three-dimensional integration; ultrasonication; Bonding; Carbon nanotubes; Conductivity; Dispersion; Plastics; Thermal conductivity; Three dimensional displays;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2011 IEEE

Conference_Location

Hanzhou

ISSN

2151-1225

Print_ISBN

978-1-4673-2288-1

Electronic_ISBN

2151-1225

Type

conf

DOI

10.1109/EDAPS.2011.6213725

Filename

6213725