Bandwidth expansion and slow-wave effect achievement of bond wire interconnection on LTCC substrate

This paper compares performances of several bandwidth expansion approaches of bond wire interconnection on low temperature co-fired ceramic (LTCC) substrate. Approaches using multiple bond wires match, lumped element match, rectangle stub match, radial stub match, butterfly stubs match and “L” shape gap match are included in the comparison. Moreover, Slow-wave effect constructed with bond wires is also presented and its slow-wave factor improved structure using crossing bond wires is proposed.