A novel method for low impedance design of power and ground planes

To eliminate the noise propagation between the power and ground planes, we propose a method by applying absorbing materials in the package. In the proposed method, absorbing materials are placed on different locations between power and ground planes to verify and compare their performance of noise reduction. From the simulation results, the absorbing materials placed along the boundary of power and ground planes shows a better performance than other layouts at the low frequency, ranging from 0.1GHz to 3.4 GHz, whereas the absorbing materials placed around the via reveals a wonderful performance at the high frequency, ranging from 6 GHz to 10 GHz.