• DocumentCode
    2283664
  • Title

    Performance issues of SOI CMOS circuits at low supply voltages

  • Author

    Abel, H.B. ; Zimmer, G.

  • Author_Institution
    Dept. of Electron Devices and Circuits, Duisburg Univ., Germany
  • fYear
    1993
  • fDate
    5-7 Oct 1993
  • Firstpage
    104
  • Lastpage
    105
  • Abstract
    Circuit applications working at typical battery voltages (1.35…1.55 V) promise to be an interesting market for SOI technology. Reduced extrinsic capacitances, low leakage currents, nearly ideal subthreshold slopes and improved scalability offer several advantages over conventional CMOS circuits, particularly in regard of power consumption and circuit speed In this paper we use the SPICE implementation of our charge sheet model of the thin-film SOI MOSFET to investigate quantitatively the performance of digital SOI CMOS circuits in the voltage range from 1 to 2 V. The charge sheet principle allows us to include the subthreshold range into the simulation without losing the consistency with well established strong inversion models. The calculations are based on a SIMOX process with tof=20 nm, t b=80 nm, tob=350 nm. The threshold voltages of the n-channel and p-channel transistors are assumed to be 0.4 V and 0.5 V, respectively. Most of the model parameters for both SOI and bulk silicon MOS devices-the latter ones are described with the SPICE Level 3 MOSFET model-have been extracted from numerical device simulations
  • Keywords
    CMOS integrated circuits; SIMOX; SPICE; circuit analysis computing; digital integrated circuits; semiconductor device models; semiconductor-insulator boundaries; silicon; transient response; 1 to 2 V; SIMOX process; SOI CMOS circuits; SPICE implementation; Si; charge sheet model; digital CMOS circuits; low supply voltages; simulation; subthreshold range; thin-film SOI MOSFET; Batteries; CMOS digital integrated circuits; CMOS technology; Capacitance; Leakage current; Low voltage; MOSFET circuits; SPICE; Scalability; Semiconductor device modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOI Conference, 1993. Proceedings., 1993 IEEE International
  • Conference_Location
    Palm Springs, CA
  • Print_ISBN
    0-7803-1346-1
  • Type

    conf

  • DOI
    10.1109/SOI.1993.344572
  • Filename
    344572