• DocumentCode
    2283800
  • Title

    Optimization Design of Highly Efficient Aluminum-Alloy Heat Sinks for Electronic Products -- Part III

  • Author

    Cheung Wai Kwan

  • Author_Institution
    Hoi Po Metal Manufactory Co. Ltd
  • fYear
    2006
  • fDate
    12-14 Nov. 2006
  • Firstpage
    54
  • Lastpage
    61
  • Abstract
    Without soldering, this aluminum material can be made into the integrative profiled aluminum. It is suitable for air-conditioning refrigeration, heat sink, warm-air, evaporators for cool-warm exchange, and heating pipes. This compound aluminum-material with high-technology is our invention. It meets the demands of both environmental protection and energy saving when it is applied to condensers of air-conditioning refrigeration system, heat-sink networks, and the specific duct devices of indoor warm-air flow. One of its features is that it may be made into the integrative hollow aluminum-sectional-bars with single-hole and with multi-holes. The aluminum alloy can be extruded into flat, square, or circular heat sinks. The planes between these heat sinks are saw-tooth sheets with integrative hollow multi-holes. The wall of internal hole has the shape of bulged corrugation teeth. In this invention, the metallic fins and metallic ducts for refrigeration or heating medium are integrated to mold. The heat sinks from this invention have the small warm resistance. The internal wall of ducts of refrigeration or heating medium is designed as the corrugation surface. Hence, the area of cool-warm exchange is increased and the cool-warm exchange and the effect of heat sink are improved noticeably. Consequently, energy is saved hugely under the same power requirement.
  • Keywords
    aluminium alloys; electronic products; heat sinks; Al; aluminum-alloy heat sinks; circular heat sinks; cool-warm exchange; electronic products; flat heat sinks; hollow multiholes; metallic ducts; metallic fins; optimization design; saw-tooth sheets; square heat sinks; Aluminum alloys; Design optimization; Ducts; Heat sinks; Heating; Protection; Refrigeration; Shape memory alloys; Soldering; Teeth;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Electronics Systems and Applications, 2006. ICPESA '06. 2nd International Conference on
  • Conference_Location
    Hong Kong
  • Print_ISBN
    962-367-544-5
  • Type

    conf

  • DOI
    10.1109/PESA.2006.343069
  • Filename
    4147782