Title :
System-level characterization of modal signaling for high-density off-chip interconnects
Author :
Milosevic, Pavle ; Schutt-Ainé, José E.
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
Abstract :
In high-speed chip-to-chip single-ended signaling links, far-end crosstalk presents one of the dominant noise sources, limiting the link performance. Diagonalizing the channel using modal decomposition has been proposed to mitigate the crosstalk. However, a practical circuit implementation of such a transceiver system will unavoidably deviate from the ideal (crosstalk-free) eigenvalue decomposition. In this paper, the impact of modal encoder/decoder coefficient quantization, random common and uncorrelated noise on signal integrity is analyzed in terms of system-level performance metrics, SNR and BER. Also discussed is the optimal selection of decoder coefficients with respect to the input-referred noise at the receiver.
Keywords :
crosstalk; error statistics; integrated circuit interconnections; quantisation (signal); radio transceivers; BER; SNR; crosstalk-free eigenvalue decomposition; far-end crosstalk; high-density off-chip interconnects; high-speed chip-to-chip single-ended signaling links; input-referred noise; modal decomposition; modal encoder/decoder coefficient quantization; modal signaling; practical circuit implementation; system-level characterization; transceiver system; uncorrelated noise; Bit error rate; Crosstalk; Decoding; Quantization; Receivers; Signal to noise ratio; Crosstalk mitigation; highspeed signaling; modal decomposition;
Conference_Titel :
Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2011 IEEE
Conference_Location :
Hanzhou
Print_ISBN :
978-1-4673-2288-1
Electronic_ISBN :
2151-1225
DOI :
10.1109/EDAPS.2011.6213748