• DocumentCode
    2284159
  • Title

    Measurement of minority carrier diffusion length and lifetime in SOI devices by flying spot laser scanner as a function of residual misfit

  • Author

    Baumgart, H. ; Egloff, R. ; Arnold, E. ; Letavic, T.J. ; Merchant, S. ; Mukherjee, S. ; Bhimnathwala, H.

  • Author_Institution
    Philips Lab., Briarcliff Manor, NY, USA
  • fYear
    1993
  • fDate
    5-7 Oct 1993
  • Firstpage
    44
  • Lastpage
    45
  • Abstract
    The recombination properties of minority carriers determine the basic electronic properties of SOI materials and control the performance of a variety of SOI devices. Knowledge of the minority carrier recombination characteristics and its correlation to residual defect density is important for the evaluation of SOI technologies with varying degrees of crystal lattice imperfection. In this work we first describe a technique based on a flying spot laser scan microscope for the measurement of minority carrier diffusion length, L, and lifetime, τ, in SOI high voltage diodes. In our experiment, laser light of 633 nm wavelength is absorbed in the Si material through the generation of electron-hole pairs which, if generated in the depletion region, are separated by the high local field to give rise to a photocurrent that can be measured
  • Keywords
    OBIC; carrier lifetime; electron-hole recombination; measurement by laser beam; metal-insulator-semiconductor devices; minority carriers; power electronics; semiconductor device testing; semiconductor-insulator boundaries; silicon; 633 nm; SOI devices; carrier diffusion length; carrier lifetime; crystal lattice imperfection; depletion region; electron-hole pairs; flying spot laser scanner; high local field; high voltage diodes; laser scan microscope; minority carrier; photocurrent; recombination properties; residual defect density; residual misfit; Crystalline materials; Diodes; Lattices; Length measurement; Microscopy; Optical materials; Photoconductivity; Spontaneous emission; Voltage; Wavelength measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOI Conference, 1993. Proceedings., 1993 IEEE International
  • Conference_Location
    Palm Springs, CA
  • Print_ISBN
    0-7803-1346-1
  • Type

    conf

  • DOI
    10.1109/SOI.1993.344600
  • Filename
    344600