DocumentCode
2284159
Title
Measurement of minority carrier diffusion length and lifetime in SOI devices by flying spot laser scanner as a function of residual misfit
Author
Baumgart, H. ; Egloff, R. ; Arnold, E. ; Letavic, T.J. ; Merchant, S. ; Mukherjee, S. ; Bhimnathwala, H.
Author_Institution
Philips Lab., Briarcliff Manor, NY, USA
fYear
1993
fDate
5-7 Oct 1993
Firstpage
44
Lastpage
45
Abstract
The recombination properties of minority carriers determine the basic electronic properties of SOI materials and control the performance of a variety of SOI devices. Knowledge of the minority carrier recombination characteristics and its correlation to residual defect density is important for the evaluation of SOI technologies with varying degrees of crystal lattice imperfection. In this work we first describe a technique based on a flying spot laser scan microscope for the measurement of minority carrier diffusion length, L, and lifetime, τ, in SOI high voltage diodes. In our experiment, laser light of 633 nm wavelength is absorbed in the Si material through the generation of electron-hole pairs which, if generated in the depletion region, are separated by the high local field to give rise to a photocurrent that can be measured
Keywords
OBIC; carrier lifetime; electron-hole recombination; measurement by laser beam; metal-insulator-semiconductor devices; minority carriers; power electronics; semiconductor device testing; semiconductor-insulator boundaries; silicon; 633 nm; SOI devices; carrier diffusion length; carrier lifetime; crystal lattice imperfection; depletion region; electron-hole pairs; flying spot laser scanner; high local field; high voltage diodes; laser scan microscope; minority carrier; photocurrent; recombination properties; residual defect density; residual misfit; Crystalline materials; Diodes; Lattices; Length measurement; Microscopy; Optical materials; Photoconductivity; Spontaneous emission; Voltage; Wavelength measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
SOI Conference, 1993. Proceedings., 1993 IEEE International
Conference_Location
Palm Springs, CA
Print_ISBN
0-7803-1346-1
Type
conf
DOI
10.1109/SOI.1993.344600
Filename
344600
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