DocumentCode
2284252
Title
Improvements in the Mechanical Structure of the Linear Switched Reluctance Motor
Author
Kwok, Antares San Chin ; Gan, Wai Chuen ; Cheung, Norbert C.
Author_Institution
Motion Group, ASM Assembly Autom. Hong Kong Ltd., Kowloon
fYear
2006
fDate
12-14 Nov. 2006
Firstpage
186
Lastpage
189
Abstract
In semiconductor manufacturing, wire bonding of chips and surface mount technology process require precise robotic linear motion. Traditionally, X-Y sliding tables driven by permanent magnet rotary motors, ball-screw and belt are used. However, they have position accuracy problem due to ball-screw backlash. Since motors and high precision grade ball-screws are expensive, high manufacturing cost is another disadvantage. Low reliability results from complex mechanical alignment and low ball-screw lifetime. This paper presents the basic structure of linear switched reluctance motor for high performance motions in manufacturing automation. No magnet is used and the traveling distance has no limitation. Consequently, this motor is extensively robust and applicable in hostile environment. A two-dimensional motor is introduced to replace the conventional X-Y table. Based on switched reluctance driving method, the proposed actuator has a very simple and robust structure with very few mechanical parts for easier manufacturing. 3 designs are compared on their mechanical structure and efficiency. Detailed motor framework description and corresponding mathematical model are shown. Applied control theory would be mentioned.
Keywords
power system control; reluctance motors; applied control theory; high performance motions; linear switched reluctance motor; manufacturing automation; mechanical structure; switched reluctance driving method; Belts; Bonding; Manufacturing processes; Permanent magnet motors; Reluctance motors; Robots; Robustness; Semiconductor device manufacture; Surface-mount technology; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Electronics Systems and Applications, 2006. ICPESA '06. 2nd International Conference on
Conference_Location
Hong Kong
Print_ISBN
962-367-544-5
Type
conf
DOI
10.1109/PESA.2006.343097
Filename
4147810
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