• DocumentCode
    2284252
  • Title

    Improvements in the Mechanical Structure of the Linear Switched Reluctance Motor

  • Author

    Kwok, Antares San Chin ; Gan, Wai Chuen ; Cheung, Norbert C.

  • Author_Institution
    Motion Group, ASM Assembly Autom. Hong Kong Ltd., Kowloon
  • fYear
    2006
  • fDate
    12-14 Nov. 2006
  • Firstpage
    186
  • Lastpage
    189
  • Abstract
    In semiconductor manufacturing, wire bonding of chips and surface mount technology process require precise robotic linear motion. Traditionally, X-Y sliding tables driven by permanent magnet rotary motors, ball-screw and belt are used. However, they have position accuracy problem due to ball-screw backlash. Since motors and high precision grade ball-screws are expensive, high manufacturing cost is another disadvantage. Low reliability results from complex mechanical alignment and low ball-screw lifetime. This paper presents the basic structure of linear switched reluctance motor for high performance motions in manufacturing automation. No magnet is used and the traveling distance has no limitation. Consequently, this motor is extensively robust and applicable in hostile environment. A two-dimensional motor is introduced to replace the conventional X-Y table. Based on switched reluctance driving method, the proposed actuator has a very simple and robust structure with very few mechanical parts for easier manufacturing. 3 designs are compared on their mechanical structure and efficiency. Detailed motor framework description and corresponding mathematical model are shown. Applied control theory would be mentioned.
  • Keywords
    power system control; reluctance motors; applied control theory; high performance motions; linear switched reluctance motor; manufacturing automation; mechanical structure; switched reluctance driving method; Belts; Bonding; Manufacturing processes; Permanent magnet motors; Reluctance motors; Robots; Robustness; Semiconductor device manufacture; Surface-mount technology; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Electronics Systems and Applications, 2006. ICPESA '06. 2nd International Conference on
  • Conference_Location
    Hong Kong
  • Print_ISBN
    962-367-544-5
  • Type

    conf

  • DOI
    10.1109/PESA.2006.343097
  • Filename
    4147810