DocumentCode :
2284314
Title :
Partial discharge stressing of filled epoxy resin surfaces
Author :
Hepburn, D.M. ; Kemp, I.J. ; Richardson, R.T.
Author_Institution :
Glasgow Caledonian Univ., UK
fYear :
1996
fDate :
23-26 Sep 1996
Firstpage :
330
Lastpage :
333
Abstract :
The work described herein investigates the effect of both partial discharge and chemical/radiation stressing on a bisphenol-A epoxy resin which has had one of three fillers added. The three fillers selected for investigation were alumina (Al2O3), silica (SiO 2) and wollastonite (CaSiO3). These three fillers were selected to cover the range of shape of particle and acidity of filler material commonly in use in industry today
Keywords :
surface discharges; acidity; bisphenol-A epoxy resin surface; chemical stress; inorganic filler; partial discharge; particle shape; radiation stress;
fLanguage :
English
Publisher :
iet
Conference_Titel :
Dielectric Materials, Measurements and Applications, Seventh International Conference on (Conf. Publ. No. 430)
Conference_Location :
Bath
ISSN :
0537-9989
Print_ISBN :
0-85296-670-9
Type :
conf
DOI :
10.1049/cp:19961052
Filename :
607411
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2284314
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