Reduction of microwave attenuation in superconducting microstripline using plasma nitridation

Author

Park, S.I. ; Jinhee Kim ; Hong, H.K. ; Kim, K.-T.

Author_Institution

Electron. Devices Group, Korea Res. Inst. of Stand. & Sci., Taejon, South Korea

fYear

2002

fDate

16-21 June 2002

Firstpage

494

Lastpage

495

Abstract

We have been developed a new fabrication process of Josephson junction series array (JJA) by using reactive ion etching (RIE) and a self-aligning technique. A plasma nitridation process is also employed in improving the microwave transmission characteristics by blocking the O/sub 2/ from diffusing into the Nb ground-plane by depositing SiO/sub 2/ dielectric layer using plasma enhanced chemical vapor deposition (PECVD) at substrate temperature of 300/spl deg/C.

Keywords

Josephson effect; microstrip lines; niobium; nitridation; plasma CVD; silicon compounds; sputter etching; superconducting arrays; superconducting junction devices; superconducting microwave devices; 300 degC; Josephson junction series array; Nb ground-plane; O/sub 2/; PECVD; RIE; SiO/sub 2/ dielectric layer deposition; SiO/sub 2/-Nb; chemical vapor deposition; fabrication process; microwave attenuation reduction; plasma enhanced CVD; plasma nitridation process; reactive ion etching; self-aligning technique; superconducting microstripline; Attenuation; Dielectric substrates; Fabrication; Josephson junctions; Microstrip; Plasma applications; Plasma chemistry; Plasma properties; Plasma temperature; Superconducting microwave devices;

fLanguage

English

Publisher

ieee

Conference_Titel

Precision Electromagnetic Measurements, 2002. Conference Digest 2002 Conference on

Conference_Location

Ottawa, Ontario, Canada

Print_ISBN

0-7803-7242-5

Type

conf

DOI

10.1109/CPEM.2002.1034938

Filename

1034938