• DocumentCode
    2284949
  • Title

    Numerical simulation of the effect of EHD flow on corona discharge in compressed air

  • Author

    Zhao, Lin ; Adamiak, Kazimierz

  • Author_Institution
    Gannon Univ., Erie, PA, USA
  • fYear
    2011
  • fDate
    9-13 Oct. 2011
  • Firstpage
    1
  • Lastpage
    7
  • Abstract
    This paper presents the numerical study of the effect of electrohydrodynamic flow on corona discharge in a pin-plate system in compressed air (one to sixty atmospheres pressure). The coupled electric and gas flow fields were solved simultaneously by using the commercial CFD FLUENT software. A hybrid numerical algorithm based on the Boundary Element Method, the Finite Element Method and the Method of Characteristics was employed to calculate the electric conditions solving both the Poisson´s and charge transport equations. This part is coded as the User-Defined-Function in FLUENT and the gas flow simulation does not start until the calculation of the electric field is convergent. It has been shown that the ion convection effect increases with the increase of pressure. Under higher operation pressures the corona current is no longer proportional to the ion mobility and neglecting the influence of EHD flow on corona discharge may result in significant errors.
  • Keywords
    Poisson equation; boundary-elements methods; corona; electrohydrodynamics; finite element analysis; ion mobility; plasma flow; plasma simulation; plasma transport processes; CFD FLUENT software; EHD flow; FLUENT; Poisson equation; boundary element method; charge transport equation; compressed air; corona current; corona discharge; finite element method; gas flow; gas flow simulation; numerical simulation; pin-plate system; user-defined-function; Corona; Electrodes; Equations; Finite element methods; Gold; Mathematical model; Compressed gases; Corona discharge; Electrohydrodynamic flow; Numerical simulation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industry Applications Society Annual Meeting (IAS), 2011 IEEE
  • Conference_Location
    Orlando, FL
  • ISSN
    0197-2618
  • Print_ISBN
    978-1-4244-9498-9
  • Type

    conf

  • DOI
    10.1109/IAS.2011.6074283
  • Filename
    6074283