DocumentCode
2284991
Title
Research on TSV positioning in 3D IC placement
Author
Ligang Hou ; Shu Bai ; Jinhui Wang
Author_Institution
VLSI & Syst. Lab., Beijing Univ. of Technol., Beijing, China
fYear
2011
fDate
12-14 Dec. 2011
Firstpage
1
Lastpage
4
Abstract
This paper forwards two TSV positioning algorithm named middle-cut positioning (MCP) and optimized area positioning (OAP). In 3D IC placement, TSV occupies cell area and its position does affect the real wire length which is ignored in previous works. Its effect should be considered by TSV based wirelength calculation and TSV positioning. Experiments are carried out on 2D-3D transformation of IBM benchmark circuits. Results shows that OAP outrun MCP, which optimized total wirelength in 15 out of 17 benchmark circuits, in which best optimized 11.81%.
Keywords
three-dimensional integrated circuits; 2D-3D transformation; 3D IC placement; IBM benchmark circuit; MCP; OAP; TSV based wirelength calculation; TSV positioning; middle-cut positioning; optimized area positioning; Benchmark testing; Design automation; Integrated circuit modeling; Solid modeling; Three dimensional displays; Through-silicon vias;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2011 IEEE
Conference_Location
Hanzhou
ISSN
2151-1225
Print_ISBN
978-1-4673-2288-1
Electronic_ISBN
2151-1225
Type
conf
DOI
10.1109/EDAPS.2011.6213801
Filename
6213801
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