Insight to the 2DEG transport and mobility effects of a 20nm recessed gate InAlN/AlN/GaN HEMT

Author

Bhattacharjee, A. ; Lenka, T.R.

Author_Institution

Dept. of Electron. & Commun. Eng., Nat. Inst. of Technol. Silchar, Silchar, India

fYear

2014

fDate

13-14 Feb. 2014

Firstpage

1

Lastpage

3

Abstract

HEMT as a microwave component has undergone a lot of experimentation for the last three decades since its invention at Bell labs by Takashi Mimura. InAlN has proved to be an extremely useful ternary semiconductor compound for its excellent scalability and high breakdown field[1] and turned out to be an ideal replacement for AlGaN as barrier for modern day HEMT´s. In this paper we report a 20nm InAlN/AlN/GaN HEMT for which InAlN acts as donor as well as barrier layer. The barrier layer was intentionally doped to improve the current capability and we registered an I_ON/I_OFF ratio of 10^10.1 for our device and on comparison with the conventional InAlN/GaN HEMT having an undoped barrier we have seen that the proposed device have a 10⁵ times better I_ON/I_OFF ratio. In this paper we discuss about the 2DEG transport properties and mobility performance for the device under consideration.

Keywords

III-V semiconductors; aluminium compounds; carrier mobility; gallium compounds; high electron mobility transistors; indium compounds; ternary semiconductors; two-dimensional electron gas; wide band gap semiconductors; 2DEG transport properties; AlN; GaN; HEMT; InAlN; barrier layer; high breakdown field; microwave component; mobility effects; mobility performance; size 20 nm; ternary semiconductor compound; undoped barrier; Gallium nitride; HEMTs; III-V semiconductor materials; Logic gates; Microwave FET integrated circuits; Microwave integrated circuits; Periodic structures; 2DEG; Elctron Density; HEMT; InAlN; Mobility;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics and Communication Systems (ICECS), 2014 International Conference on

Conference_Location

Coimbatore

Print_ISBN

978-1-4799-2321-2

Type

conf

DOI

10.1109/ECS.2014.6892645

Filename

6892645