DocumentCode :
2285142
Title :
A novel hierarchical radial tree based on constructal theory for PCB power plane
Author :
Huang, Huifen ; Liu, Shiyun ; Deng, Liangyong
Author_Institution :
Sch. of Electron. & Inf. Eng., South China Univ. of Technol., Guangzhou, China
fYear :
2011
fDate :
12-14 Dec. 2011
Firstpage :
1
Lastpage :
4
Abstract :
This paper proposes a hierarchical radial tree distribution network based on constructal theory for optimal direct current performance in printed circuit board power plane. The optimal radial tree dimensions of each order are obtained for optimal voltage drop and resistance. The constraints are the total areas of the plane and the high conductivity paths. The degrees of freedom are the width/length ratio Hi/Li of the constructal block, high conductivity paths ratio Di+1/Di (i=1, 2, etc). According to constructal theory, the optimal performance consists of constructing the giving area in a sequence of building blocks from the smallest size toward larger sizes hierarchically. High assembly level is not necessary. The optimal order is 12 for the designed tree. Then a radial PCB power plane is developed based on the radial tree which illustrates that the designed plane has multifunctions of low voltage drop, current robustness, equidistribution, compactness and effective noise isolation while maintaining a relatively simple design of geometry.
Keywords :
printed circuits; trees (mathematics); PCB power plane; constructal block; constructal theory; current robustness; effective noise isolation; equidistribution; hierarchical radial tree distribution network; high conductivity paths; low voltage drop; optimal direct current performance; optimal performance; printed circuit board power plane; Assembly; Conductivity; Current distribution; Noise; Optimized production technology; Resistance; Solids; PCB power plane; Radial tree; constructal theory; power integrity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2011 IEEE
Conference_Location :
Hanzhou
ISSN :
2151-1225
Print_ISBN :
978-1-4673-2288-1
Electronic_ISBN :
2151-1225
Type :
conf
DOI :
10.1109/EDAPS.2011.6213809
Filename :
6213809
Link To Document :
بازگشت