DocumentCode :
2285646
Title :
Modeling of polymer neck generation and its effects on the etch profile for oxide contact hole etching using Ar, CHF/sub 3/, and CF/sub 4/ gases
Author :
Jinsung Park ; Hoong Joo Lee ; Jeong-Taek Kong ; Sang Hoon Lee
Author_Institution :
CAE Semicond. R&D Center, Samsung Electron. Co. Ltd., Kyungki-Do, South Korea
fYear :
1997
fDate :
8-10 Sept. 1997
Firstpage :
285
Lastpage :
287
Abstract :
A simple model, which takes into account simultaneous ion-assisted etching and polymer deposition, is presented. The simulation and experiment of test structures show that polymer neck generation is the result of competition of ion assisted etching and polymer deposition along the the sidewall of the contact hole. As the polymer neck also plays as a self-shadowing mask, it determines the final etch profile of the contact hole.
Keywords :
polymer films; semiconductor process modelling; sputter etching; Ar; Ar gas; CF/sub 4/ gas; CHF/sub 3/ gas; contact hole sidewall; etch profile; ion-assisted etching; model; oxide contact hole etching; polymer deposition; polymer neck generation; self-shadowing mask; Argon; Gases; Neck; Plasma applications; Plasma simulation; Polymers; Resists; Shape; Sputter etching; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Simulation of Semiconductor Processes and Devices, 1997. SISPAD '97., 1997 International Conference on
Conference_Location :
Cambridge, MA, USA
Print_ISBN :
0-7803-3775-1
Type :
conf
DOI :
10.1109/SISPAD.1997.621393
Filename :
621393
Link To Document :
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