Impact of Nanotechnology on Wireless Communications

Author

Li, Er-Ping

Author_Institution

Inst. of High Performance Comput., Singapore

fYear

2007

fDate

16-17 Aug. 2007

Abstract

The next-generation high data rate wireless communication systems are expected to offer a completely new ways to access information and services. The need of higher data transfer rate and bandwidth, along with the requirement for low-cost, high efficiency system implementation, has led to an explosion in new technology development for integrated circuit approaches in RF/microwave area, RF receiver& transmitter, data storage and even power supply. A total solution for high system integration of various components is the trend, the 3D system-on-package concept is considered as one of the future solutions. To realize such as complex concept, nanotechnology could play a significant role for continuing innovation in mobile devices, but it faces a lot challenges. This presentation will touch on the concepts of possible impacts of nanotechnology on communication evolution.

Keywords

integrated circuit packaging; microwave integrated circuits; nanotechnology; radiocommunication; 3D system-on-package concept; RF receiver; RF transmitter; RF-microwave area; data storage; integrated circuit approach; mobile device; nanotechnology; wireless communication; Bandwidth; Explosions; Integrated circuit technology; Microwave integrated circuits; Microwave technology; Nanotechnology; Radio frequency; Radiofrequency integrated circuits; Transmitters; Wireless communication; Multilayer Package Analysis; Nanotechnology; Wireless Communication;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, 2007 International Symposium on

Conference_Location

Hangzhou

Print_ISBN

978-1-4244-1045-3

Electronic_ISBN

978-1-4244-1045-3

Type

conf

DOI

10.1109/MAPE.2007.4393805

Filename

4393805