• DocumentCode
    2286537
  • Title

    A module-based iron loss evaluation scheme for electric machinery products

  • Author

    Liu, Cheng-Tsung ; Lin, Hsiu-Ying ; Hsu, Yu-Wei ; Lin, Sheng-Yang

  • Author_Institution
    Dept. of Electr. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan
  • fYear
    2011
  • fDate
    9-13 Oct. 2011
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    A systematic scheme that can provide reasonable and fast iron loss evaluations of electric machineries that are constructed by laminated electromagnetic steels will be proposed. With their various structural arrangements and magnetization inputs, fluxes flowing inside those machine cores will not be uniformly distributed. Hence, estimations of machine iron losses based on the steel manufacturers´ datasheets will exhibit large deviations from the actual ones, and uncertainties are always arisen on the selections of proper steel materials. By partitioning the machine cores based on proper boundary constraints, rational fluxes on the machine parts can be estimated. The evaluation scheme is thus formulated by integrating the module-based iron loss information and the estimated flux information. From comparison results, it is confirmed that this scheme will provide a reliable evaluation tool that can bridge the accuracy gaps among hardware product measurements and material datasheet estimations.
  • Keywords
    electric machines; electrical products industry; laminates; magnetic cores; magnetic flux; steel; electric machinery products; laminated electromagnetic steels; machine cores; magnetic fluxes; magnetization inputs; module-based iron loss evaluation scheme; steel manufacturer datasheet; steel materials; Area measurement; Magnetic flux; Probes; Stators; Steel; Strips; Windings; Epstein Frame test; Inverse Jiles-Atherton hysteresis model; Steimnetz´s relationships; magnetic equivalent circuit; needle probe method;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industry Applications Society Annual Meeting (IAS), 2011 IEEE
  • Conference_Location
    Orlando, FL
  • ISSN
    0197-2618
  • Print_ISBN
    978-1-4244-9498-9
  • Type

    conf

  • DOI
    10.1109/IAS.2011.6074386
  • Filename
    6074386