• DocumentCode
    2287219
  • Title

    Study on Heat Fading of Phenolic Resin Friction Material for Micro-automobile Clutch

  • Author

    Huang Feng ; Mo Yimin ; Lv Juncheng

  • Author_Institution
    Sch. of Mech. & Electron. Eng., Wuhan Univ. of Technol., Wuhan, China
  • Volume
    3
  • fYear
    2010
  • fDate
    13-14 March 2010
  • Firstpage
    596
  • Lastpage
    599
  • Abstract
    Basing on the national test standard GB/5763-98 for fixed speed friction tester, a sample test has been designed to study the friction behavior of friction material for micro-automobile clutch. This test was applied with constant load at different temperatures and various sliding speeds. The heat fading mechanism of friction material was analyzed by scanning electron microscopy (SEM). It is concluded that the heat fading is caused by the dynamic lubrication of lubricating layer or air cushion layer created by the heat decomposition of resin at high temperature, which consequently results in dramatic decline of friction coefficients. And the mechanism is the transition from dry friction of the typical abrasive wear and adhesive wear to lubrication friction with liquid-lubricating abrasive wear.
  • Keywords
    clutches; friction; lubrication; resins; scanning electron microscopy; abrasive wear; adhesive wear; air cushion layer; dynamic lubrication; fixed speed friction tester; heat fading; micro-automobile clutch; phenolic resin friction material; scanning electron microscopy; Automatic testing; Composite materials; Electronic equipment testing; Fading; Friction; Materials testing; Optical fiber testing; Resins; Stability; Temperature; friction material; friction performance test; heat fading; micro-automobile clutches;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Measuring Technology and Mechatronics Automation (ICMTMA), 2010 International Conference on
  • Conference_Location
    Changsha City
  • Print_ISBN
    978-1-4244-5001-5
  • Electronic_ISBN
    978-1-4244-5739-7
  • Type

    conf

  • DOI
    10.1109/ICMTMA.2010.386
  • Filename
    5459128