Title :
4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)
Abstract :
The following topics were dealt with: adhesion and interfacial properties; smart card interconnection; reliability; ACAs; and high-density substrates
Keywords :
adhesion; adhesives; conducting polymers; encapsulation; flip-chip devices; integrated circuit interconnections; integrated circuit packaging; reliability; smart cards; ACAs; adhesion; conducting polymers; high-density substrates; interfacial properties; reliability; smart card interconnection;
Conference_Titel :
Neural Networks, 2000. IJCNN 2000, Proceedings of the IEEE-INNS-ENNS International Joint Conference on
Conference_Location :
Como, Italy
Print_ISBN :
0-7695-0619-4
DOI :
10.1109/IJCNN.2000.859468
