Title : 
Software-friendly HW/SW Co-Simulation: An Industrial Case Study
         
        
            Author : 
Noguera, Juanjo ; Baldez, Luis ; Simon, Narcis ; Abello, Lluis
         
        
            Author_Institution : 
InkJet Commercial Div., Hewlett-Packard, Barcelona
         
        
        
        
        
        
        
            Abstract : 
This paper proposes a novel HW/SW co-simulation approach that minimizes the impact on software designers. We propose a SystemC-based system that enables the software team to test their software with their own tools and environment using an accurate simulated ASIC (application specific integrated circuit) model. The solution presented here enables a smooth and early ASIC and SW integration, which reduces the project development time and improves the ASIC design quality (i.e., SW engineers can help in the ASIC verification and ASIC engineers can help in the SW development). In this solution, the real and full software (i.e., multi-threaded application) runs in its native environment with minimal changes and interfaces with a simulated ASIC model using sockets. We have tested this approach on a pilot-project, which has demonstrated the feasibility of this co-development methodology
         
        
            Keywords : 
application specific integrated circuits; formal verification; hardware-software codesign; integrated circuit modelling; integrated circuit testing; software development management; ASIC; HW/SW co-simulation; SystemC; application specific integrated circuit model; design quality; software designers; verification; Application specific integrated circuits; Circuit simulation; Circuit testing; Computer industry; Design engineering; Integrated circuit testing; Software design; Software testing; Software tools; System testing;
         
        
        
        
            Conference_Titel : 
Design, Automation and Test in Europe, 2006. DATE '06. Proceedings
         
        
            Conference_Location : 
Munich
         
        
            Print_ISBN : 
3-9810801-1-4
         
        
        
            DOI : 
10.1109/DATE.2006.243811