Title :
Characteristics of electrohydrodynamic pump of the dissociation type: Low- and high-voltage ranges
Author :
Chirkov, V.A. ; Stishkov, Yu.K. ; Vasilkov, S.A.
Author_Institution :
Phys. Dept., St. Petersburg State Univ., St. Petersburg, Russia
fDate :
June 29 2014-July 3 2014
Abstract :
The paper presents the results of the computer simulation of a single section of electrohydrodynamic (EHD) conduction pump with and without taking into account the enhancement of the dissociation rate under the effect of the strong electric field (the Wien effect). The numerical computations were carried out on the basis of the complete set of EHD equations using commercial software package COMSOL Multiphysics. The behavior of EHD flow inside the pump was investigated for different ratios between positive and negative ion mobilities and the effect of the latter on the pumping efficiency was estimated. The features of the pump operation in the case of the Wien effect occurrence were investigated. It was shown that the enhancement of the dissociation rate can lead to the reversion of EHD flow direction with increasing voltage. Besides, the results obtained in the presented computer model was compared to those obtained in the simplified one (based on the hydrostatic approach) and considerable discrepancy between the calculated pressure drops was revealed.
Keywords :
Wien effect; computational fluid dynamics; dissociation; electrohydrodynamics; flow simulation; hydrostatics; ion mobility; negative ions; numerical analysis; positive ions; pumps; EHD equations; Wien effect occurrence; computer simulation; dissociation rate enhancement; electric field effect; electrohydrodynamic conduction pump characteristics; high-voltage ranges; hydrostatic approach; low-voltage ranges; numerical computations; positive-negative ion mobility ratios; pressure drop calculation; Dielectrics; Force; EHD conduction pumping; computer simulation; field-enhanced dissociation; ion mobility; low-conducting liquids;
Conference_Titel :
Dielectric Liquids (ICDL), 2014 IEEE 18th International Conference on
Conference_Location :
Bled
DOI :
10.1109/ICDL.2014.6893114