Title :
Environmental stress screening strategies for multi-component systems with Weibull failure-times and imperfect failure detection
Author :
Pohl, Edward A. ; Dietrich, Duane L.
Author_Institution :
Dept. of Aeronaut. & Astronaut., Air Force Inst. of Technol., Wright-Patterson AFB, OH, USA
Abstract :
Environmental stress screening (ESS) is employed to reduce, if not eliminate, the occurrence of early field failures. In this paper, a general two-level ESS model is presented for a multi-component electronic system. Screening is performed at the component and unit level. Components and connections are assumed to come from good and substandard populations and their time-to-failure distributions are modeled with mixture distributions. ESS models currently found in the literature assume that time-to-failure distributions are mixtures of exponentials. This paper extends previous work by examining mixtures of Weibull distributions for all assembly levels. The mixed Weibull distribution is used to examine how screening strategies change when wear-out mechanisms are present, Also, this paper relaxes the assumption that all failures precipitated by the screening process are found before being used in subsequent assembly levels. Numerical examples are provided to illustrate the screening model. Significant changes in screening strategies are found when the assumptions of perfect failure detection and exponentiality are relaxed
Keywords :
Weibull distribution; electronic equipment testing; environmental stress screening; failure analysis; reliability; Weibull distributions; Weibull failure-times; assembly levels; electronic system; environmental stress screening; imperfect failure detection; life cycle cost; mixture distributions; multi-component systems; renewal function; time-to-failure distributions; two-level model; wear-out mechanisms; Acceleration; Assembly; Cost function; Electronic switching systems; Failure analysis; Manufacturing processes; Process design; Production facilities; Stress; Weibull distribution;
Conference_Titel :
Reliability and Maintainability Symposium, 1995. Proceedings., Annual
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-2470-6
DOI :
10.1109/RAMS.1995.513250