DocumentCode
2289873
Title
Test-time compression for qualification testing of electronic packages: a case study
Author
Rothman, Timothy P. ; Dasgupta, Abhijit ; Hu, J.M.
Author_Institution
CALCE Center for Electron. Packaging, Maryland Univ., College Park, MD, USA
fYear
1995
fDate
16-19 Jan 1995
Firstpage
246
Lastpage
252
Abstract
This paper illustrates a methodology for using physics-of-failure models to extract acceleration transform information from limited test data under accelerated stresses. Test time compression is achieved by appropriately accelerating the stress levels in order to obtain accurate information on reliability. The critical variables are identified and their influence on the stress magnitude is quantified using physics-of-failure models. The total amount of testing time is minimized by tailoring the critical variables in each sample such that multiple stress levels can be achieved in the samples under a single loading. This type of parametric-accelerated test eliminates the need for repeating the test at multiple load levels. Such techniques are essential for cost effective and timely qualification testing of highly reliable modules under accelerated stresses. All sources of error due to experimental variables and assumptions or simplifications in the analytical model are closely examined and discussed. Future work will employ a more detailed physics-of-failure model to quantify the experimental results. These test results also validate physics-of-failure models for acceleration transforms which relate test data to field reliability. Analytical predictive models for acceleration transforms will obviously result in significant savings of cost and time during qualification
Keywords
circuit reliability; circuit testing; failure analysis; life testing; packaging; reliability theory; accelerated stress levels; acceleration transform; case study; electronic packages; field reliability; multiple stress levels; physics-of-failure models; predictive models; qualification testing; reliability; test-time compression; Computer aided software engineering; Costs; Electronic equipment testing; Electronics packaging; Failure analysis; Life estimation; Qualifications; Soldering; Thermal expansion; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability and Maintainability Symposium, 1995. Proceedings., Annual
Conference_Location
Washington, DC
ISSN
0149-144X
Print_ISBN
0-7803-2470-6
Type
conf
DOI
10.1109/RAMS.1995.513253
Filename
513253
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