• DocumentCode
    2289873
  • Title

    Test-time compression for qualification testing of electronic packages: a case study

  • Author

    Rothman, Timothy P. ; Dasgupta, Abhijit ; Hu, J.M.

  • Author_Institution
    CALCE Center for Electron. Packaging, Maryland Univ., College Park, MD, USA
  • fYear
    1995
  • fDate
    16-19 Jan 1995
  • Firstpage
    246
  • Lastpage
    252
  • Abstract
    This paper illustrates a methodology for using physics-of-failure models to extract acceleration transform information from limited test data under accelerated stresses. Test time compression is achieved by appropriately accelerating the stress levels in order to obtain accurate information on reliability. The critical variables are identified and their influence on the stress magnitude is quantified using physics-of-failure models. The total amount of testing time is minimized by tailoring the critical variables in each sample such that multiple stress levels can be achieved in the samples under a single loading. This type of parametric-accelerated test eliminates the need for repeating the test at multiple load levels. Such techniques are essential for cost effective and timely qualification testing of highly reliable modules under accelerated stresses. All sources of error due to experimental variables and assumptions or simplifications in the analytical model are closely examined and discussed. Future work will employ a more detailed physics-of-failure model to quantify the experimental results. These test results also validate physics-of-failure models for acceleration transforms which relate test data to field reliability. Analytical predictive models for acceleration transforms will obviously result in significant savings of cost and time during qualification
  • Keywords
    circuit reliability; circuit testing; failure analysis; life testing; packaging; reliability theory; accelerated stress levels; acceleration transform; case study; electronic packages; field reliability; multiple stress levels; physics-of-failure models; predictive models; qualification testing; reliability; test-time compression; Computer aided software engineering; Costs; Electronic equipment testing; Electronics packaging; Failure analysis; Life estimation; Qualifications; Soldering; Thermal expansion; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability and Maintainability Symposium, 1995. Proceedings., Annual
  • Conference_Location
    Washington, DC
  • ISSN
    0149-144X
  • Print_ISBN
    0-7803-2470-6
  • Type

    conf

  • DOI
    10.1109/RAMS.1995.513253
  • Filename
    513253