Title :
Three dimensional transmission lines and special elements design
Author :
Darwish, Ali ; Ezzeddine, Amin ; Huang, Ho C. ; Mah, Misoon ; Cook, James
Author_Institution :
AMCOM Communications, Inc., Clarksburg, MD, USA
Abstract :
We report the development of a broadband 3D balun circuit exhibiting superior performance due to ground plane removal and unique 3D features. The 3D balun provides balancing action from 2.05 GHz to 2.65 GHz with ±5 degrees and ±0.5 dB phase and amplitude imbalance, respectively. The design concept can be generalized to most frequencies and/or fabrication processes. In addition we present the performance of a 3D X-band amplifier implemented using a 12-layer low temperature cofired ceramic (LTCC) process
Keywords :
baluns; microwave amplifiers; transmission lines; 2.05 to 2.65 GHz; 3D X-band amplifier; broadband 3D balun circuit; low temperature cofired ceramic process; special element design; three-dimensional transmission line; Ceramics; Fabrication; Frequency; Impedance matching; Microwave circuits; Microwave devices; Power amplifiers; Temperature; Transmission line theory; Transmission lines;
Conference_Titel :
Circuits and Systems, 2001. MWSCAS 2001. Proceedings of the 44th IEEE 2001 Midwest Symposium on
Conference_Location :
Dayton, OH
Print_ISBN :
0-7803-7150-X
DOI :
10.1109/MWSCAS.2001.986318
