Title :
Liquid flow-through cooling for avionics applications
Author :
Barwick, M. ; Midkiff, M. ; Seals, D.
Author_Institution :
AT&T Bell Labs., Whippany, NJ, USA
Abstract :
An avionics cooling system has been developed that circulates fluid through the structural frame of its SEM-E modules. The liquid flow-through (LFT) module frame is only 100 mils thick, yet is capable of maintaining low junction and surface temperatures for modules dissipating in excess of 200 W. The module form/factor is compatible with existing SEM-E circuit board formats and connectors and features toolless, dripless, quick-disconnect removal and insertion. A prototype avionics cooling system has been developed consisting of 52 LFT modules and a parallel feed rack/manifold. Both the module and the system have demonstrated outstanding cooling efficiency, and good reliability under preliminary shock and vibration testing. Cooling tests show a significant improvement over edge-conduction cooling. Thermal comparison tests indicate a 20°C improvement in frame surface temperature over an edge-conduction-cooled 50 W module
Keywords :
aircraft instrumentation; cooling; 200 W; SEM-E modules; avionics cooling; efficiency; form/factor; liquid flow through cooling; module frame; parallel feed rack/manifold; prototype; reliability; surface temperatures; Aerospace electronics; Clocks; Electronics cooling; Microelectronics; Prototypes; Temperature; Thermal expansion; Thermal management; Thermal management of electronics; Thermal stresses;
Conference_Titel :
Aerospace and Electronics Conference, 1991. NAECON 1991., Proceedings of the IEEE 1991 National
Conference_Location :
Dayton, OH
Print_ISBN :
0-7803-0085-8
DOI :
10.1109/NAECON.1991.165750
