DocumentCode
2297575
Title
Physical Modelling of the Kink Effect in Strained InGaAs/InAlAs pHEMTs
Author
Arshad, S. ; Mohiuddin, M. ; Bouloukou, A. ; Missous, M.
Author_Institution
Sch. of Electr. & Electron. Eng., Univ. of Manchester, Manchester
fYear
2008
fDate
12-16 Oct. 2008
Firstpage
55
Lastpage
58
Abstract
The InAlAs/InGaAs material system provides one of the highest transconductance pHEMT devices at a given gate size because of its large conduction band discontinuity, high electron mobility and very good carrier confinement in the channel. The DC characteristics, however, show a sudden rise in drain current at fixed value of drain voltage, resulting in high drain conductance and reduced voltage gain. This undesirable phenomenon is called Kink Effect. In this work a comprehensive understanding of the causes of this effect is developed using a 2-D physical device simulator. The modelled pHEMT is a layered structure that simulates the epitaxial layers of the fabricated device grown by MBE[1]. The developed model takes into account field dependent mobility, generation recombination mechanisms and deep-level traps are used. With the help of these physical models, threshold voltage, drain saturation and gate leakage current are successfully simulated and agree well with the measured results.
Keywords
aluminium compounds; gallium compounds; high electron mobility transistors; indium compounds; 2D physical device simulator; InGaAs-InAlAs; Kink effect; MBE; deep-level traps; drain saturation; field dependent mobility; gate leakage current; generation recombination mechanisms; material system; physical modelling; threshold voltage; transconductance pHEMT devices; Carrier confinement; Conducting materials; Electron mobility; Epitaxial layers; Indium compounds; Indium gallium arsenide; PHEMTs; Semiconductor process modeling; Transconductance; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Devices and Microsystems, 2008. ASDAM 2008. International Conference on
Conference_Location
Smolenice
Print_ISBN
978-1-4244-2325-5
Electronic_ISBN
978-1-4244-2326-2
Type
conf
DOI
10.1109/ASDAM.2008.4743357
Filename
4743357
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